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TECHNOLOGY

Technology Capability

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Item 2017 2018 2019
Layer  46 46 48
Max. Board Size (mm) 910*600 1100*630 1100*630
Max. Board Thickness 8mm 10mm 10mm
Min. Board Thickness 0.3mm 0.3mm 0.3mm
Min. Core Thickness 0.05mm 0.05mm 0.05mm
Max. Final Copper Thickness  Inner Layer 10OZ 12OZ 12OZ
Outer Layer 10OZ 12OZ 12OZ
Min. Line Width/Space 3/3mil 3/3mil 3/3mil
Min. CNC Drilling Size 0.15mm 0.15mm 0.15mm
Min. Laser Drilling Size 0.10mm 0.10mm 0.10mm
Aspect Ratio 13:1 13:1 15:1
Impedance Control Tolerance +/-5% +/-5% +/-5%
Surface Finishing ENIG, Plated Gold, HASL, LF-HASL, Gold finger, OSP,
 Immersion Silver, Immersion Tin, etc.
ENIG, Plated Gold, HASL, LF-HASL, Gold finger, OSP, 
Immersion Silver, Immersion Tin, etc.
ENIG, Plated Gold, HASL, LF-HASL, Gold finger, OSP, 
Immersion Silver, Immersion Tin, etc.
HDI Ability 4+N+4 4+N+4 5+N+5
Rigid-Flexible Board Layer 16 18 20
Heat Sink Mass Production Mass Production Mass Production
Embedded Capacitance Prototype Mass Production Mass Production
Embedded Resistance Prototype Mass Production Mass Production